Canada - RFP -A Vapour Hydrofluoric (VHF) Etching system

Description

*** NOTE: The SFU RFP for a Vapour Hydrofluoric (VHF) Etching system is available for download from Merx. All submissions for the RFP must be done thru the Merx Platform*** Website is Merx.comThe RFP invites proposals for the provision of the following equipment:A Vapour Hydrofluoric (VHF) Etching SystemTHE DELIVERABLES4D LABS at Simon Fraser University is acquiring infrastructure to further develop quantum and microsystems-based technologies. The lab is seeking a Vapour Hydrofluoric (VHF) Etching system. The VHF Etching system will be housed in a Class 100 Clean Room facility, alongside a variety of micro- and nanofabrication equipment.The VHF Etching system should meet the following criteria: Designed for low-to-medium scale research and development Flexible to allow for a wide range of materials to be used Suitable for use in a multi-user facility with low service requirements Simple to operate Please provide clear VHF Etching system requirements in the quote, including: Floor loading Electrical power supply (e.g., 208V or 120V) Cooling (pressure, flow, and heat load) Exhaust Gases Mandatory Specifications for VHF Etching system:Basic Configuration (mandatory, must be included in site acceptance test): Automated vapour VHF etching system to remove oxides primarily for MEMS release Complete recipes and process characterization results for high-etch-rate and high-selectivity process options Selectivity data requested for the following materials: SiN, Au, Al System can accommodate pieces, 4” and  6”/150mm wafers with minimal configuration modifications Rapid change between different wafer sizes or pieces Ability to process small chips and irregularly shaped substrates Process data for thermal, LPCVD, PECVD, and Sputtered silicon dioxide Comprehensive safety systems to operate the system. Complete software package to operate the system Software must include a lifetime license for use and free software upgrades for at least 3 years 1 year parts and labour warranty  Performance Specifications (mandatory): Condensation-free HF vapour etching Demonstrated SiO2 etch rate of >0.25um/min for thermal oxide Undercut (i.e., through etch holes) etch-rate uniformity across a 6” wafer of better than 10% Ability to control process pressure using a provided dry pump Optional Specifications for VHF Etching system:Optional configuration (price separately in Value Add) System can accommodate 8”/200mm wafers Process data for doped silicon dioxide layers 2 year parts and labour warranty Optional Performance Specifications (price separately in Value Add) Additional process line for alcohol vapour Lateral etch process monitoring Vertical etch process monitoring Ability to process wafers mounted on dicing tape Precise temperature control of better than 0.5ºC Consumables (optional, price separately in Supplemental Pricing): Please provide a cost and approximate lifetime for any consumables necessary to operate the machine.  These costs should be separate from the main package price.

Opportunity closing date

21 November 2024

Value of contract

to be confirmed