United States - Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) BAA
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Details
Provided by
- Opportunity closing date
- 06 November 2024
- Opportunity publication date
- 25 October 2024
- Value of contract
- to be confirmed
- Your guide to exporting
Description
The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals in the following technical areas: Advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing in integrated photonic microsystems. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
- Opportunity closing date
- 06 November 2024
- Value of contract
- to be confirmed
About the buyer
- Address
- DEF ADVANCED RESEARCH PROJECTS AGCY
Bid for tender
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