Germany - BWI is considering a framework agreement for the purchase of chip cards and production equipment.
For more information and to make a bid you will need to go to the third party website.
Details
Provided by
- Opportunity closing date
- 25 November 2024
- Opportunity publication date
- 28 October 2024
- Value of contract
- to be confirmed
- Your guide to exporting
Description
BWI is considering awarding a framework contract for the purchase of chip cards and production equipment as well as the provision of associated software and the provision of maintenance, servicing and support services for each lot with an economic operator by means of an open award procedure.
The award is divided into a total of four lots and includes the following services:
Lot 1: Purchase of card printers (to be tendered in advance under the file number "1690-CS chip cards and production equipment card printers (lot 1)"
Lot 2: Purchase of JCOP Javacards on JCOP 4.5 basis incl. MIFARE and PKI applet
Lot 3: Purchase of SmardCard HSM as DI card
Lot 4: Purchase of SmardCard HSM as USB token
The contract in lot 1 has already been put out to tender in a separate award procedure. Lots 2 - 4 are the subject of this procedure.
- Opportunity closing date
- 25 November 2024
- Value of contract
- to be confirmed
About the buyer
- Address
- BWI GmbH
Bid for tender
If your company meets the requirements of the tender, go to the website where the tender is hosted and submit your bid.
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This opportunity has been translated from its original language. You should check if you need to apply in the original language.